Lamp package



FIG. 1 is a top perspective view of a lamp package showing our new design, shown applied to an unclaimed printed circuit board;

FIG. 2 is a bottom plan view of the lamp package of the present invention;

FIG. 3 is a top plan view thereof;

FIG. 4 is a bottom plan view thereof;

FIG. 5 is a side elevation view thereof; and,

FIG. 6 is a side elevation view thereof rotated 90 degrees.

The broken lines in the drawings showing the printed circuit board in FIG. 1 and the rectangular substrate in FIGS. 1-6 are for illustrative purposes only and form no part of the claimed design. 

The ornamental design for a lamp package, as shown and described. 